Technology / Company Certificate
SSP R&D Center's research and development performances.
| Patent No | Name of Invention | View |
|---|---|---|
| 0196365 | Mount apparatus for solder ball of ball grid array |  |
| 0196366 | Solder ball adhesion method, and its apparatus of ic package | |
| 0196367 | Solder ball adhesion method, and its apparatus of ic package | |
| 0296424 | Ball feeder of the ball dispensor | |
| 0362364 | In Line system for operating ball mounting and markingin manufacturing process of semiconductor | |
| 0476076 | Attaching apparatus for housing of camera modulecomprising dipping part and attaching method using thesame | |
| 0498071 | Attaching apparatus for housing of camera module andattaching method using the same | |
| 0503760 | Automatic testing apparatus for image sensor of cameramodule and automatic testing method using the same | |
| 10-0625855 | Lens barrel combining apparatus for camera module andcombining method using the same | |
| 10-0661844 | Method of determining reference value in solder ballmounting apparatus and computer readable medium thereof | |
