沿革

以不断技术开发来达成的SSP沿革。

实现将想象变为现实的技术

2016 ~ 时下
  • Developed New Ball Mount System with Automation
  • Developed Ball Placement System Dual Head
  • Developed Filter Inspection System for Camera Module
  • ISO 45001 Certification
  • Selected as Global Small Giant Company
  • Presidential Citation in venture promotion
  • The best badge in honor the Red Cross
  • Registered 40 patents
2015 ~ 2011
  • Established New Factory & HQ (2011)
  • Developed New Ball Mount System (BPS8200, 7200FC)
  • Developed Multi Pickers Package Sorter System for EMI Shield
  • Developed Wafer Level Micro Ball Mount System
  • Selected as Hope-to-be Hired Company
  • Registered 20 patents
2010 ~ 2006
  • Developed New Ball Mount M/C (BPS 7200)
  • Developed Active Align System (Camera Module)
  • Developed FCBGA Automation Line
  • CE Certification for Auto Holder Attach System
  • 5 Million US$ Export Prize (KOTRA - 2007)
  • 10 MiLON US$ Export Prize (KOTRA - 2010)
  • ISO 14000 Certification (2010)
  • Selected as Export Blue Chip Company (Incheon City)
  • Registered 18 patents
2005 ~ 2001
  • Developed Holder Attach System (Camera Module)
  • Developed Auto Solder Ball Mount System (FCBGA)
  • Developed Auto Screen Printing System (FCBGA)
  • ISO 9000 Certification (2004)
  • Registered R&D Center (KITA - 2004)
  • Attained INNO BIZ Company (SMBA - 2004)
  • 3 Million US$ Export Prize (KOTRA - 2005)
  • Registered 6 Patents (Ball Mounting & Camera Module)
  • Move New Factory (Incheon Namdong Industrial Zone)
2000 ~ 1996
  • Founded SSP Inc(1996, 06)
  • Developed Auto Solder Ball Mount System (PBGA/CA)
  • CE Certification for Ball Mount System
  • Developed Auto Lamination System
  • Developed Semi Auto IC Cutting Equipment (FlexBGA)
  • Attained Venture Company
  • Registered 5 patents for Solder Ball Mounting Tech