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BALL PLACEMENT SYSTEM
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CAMERA MODULE ASSEMBLY SYSTEM
PACKAGE EMI SHIELDING SYSTEM
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연혁
끊임없는 기술 개발로 이루어 온 SSP의 history입니다.
상상을 현실로
만드는 기술 실현
2020 ~
2016
2015 ~
2011
2010 ~
2006
2005 ~
2001
2000 ~
1996
2020 ~ 2016
Developed New Ball Mount System with Automation
Developed Ball Placement System Dual Head
Developed Filter Inspection System for Camera Module
ISO 45001 Certification
Selected as Global Small Giant Company
Presidential Citation in venture promotion
The best badge in honor the Red Cross
Registered 40 patents
2015 ~ 2011
Established New Factory & HQ (2011)
Developed New Ball Mount System (BPS8200, 7200FC)
Developed Multi Pickers Package Sorter System for EMI Shield
Developed Wafer Level Micro Ball Mount System
Selected as Hope-to-be Hired Company
Registered 20 patents
2010 ~ 2006
Developed New Ball Mount M/C (BPS 7200)
Developed Active Align System (Camera Module)
Developed FCBGA Automation Line
CE Certification for Auto Holder Attach System
5 Million US$ Export Prize (KOTRA - 2007)
10 MiLON US$ Export Prize (KOTRA - 2010)
ISO 14000 Certification (2010)
Selected as Export Blue Chip Company (Incheon City)
Registered 18 patents
2005 ~ 2001
Developed Holder Attach System (Camera Module)
Developed Auto Solder Ball Mount System (FCBGA)
Developed Auto Screen Printing System (FCBGA)
ISO 9000 Certification (2004)
Registered R&D Center (KITA - 2004)
Attained INNO BIZ Company (SMBA - 2004)
3 Million US$ Export Prize (KOTRA - 2005)
Registered 6 Patents (Ball Mounting & Camera Module)
Move New Factory (Incheon Namdong Industrial Zone)
2000 ~ 1996
Founded SSP Inc (1996, 06)
Developed Auto Solder Ball Mount System (PBGA/CA)
CE Certification for Ball Mount System
Developed Auto Lamination System
Developed Semi Auto IC Cutting Equipment (FlexBGA)
Attained Venture Company
Registered 5 patents for Solder Ball Mounting Tech