Laser tech enables to locally heat the bonding area, which minimize the overall thermal exposure to sensitive devices. Also provide consistent STIM bond line thickness control.
| ITEM | SPEC | REMARK | |
|---|---|---|---|
| Material | Substrate | Max. 300mm | |
| Metal TIM | Reel type | ||
| Machine | Laser | 2 ~ 20Kw | - |
| 920 ~ 1080nm | - | ||
| Optic | 10 X 10mm ~ 300 X 300mm | Depend on Material Size | |
| Loading | Tray / Boat | - | |
| BLT Control | BLT < ±10um | - | |
| Dimension | 1750mm * 1680mm * 2450mm | W*L*H | |
| Function | Real Time Temp. Monitoring | IR Camera | |
| Laser Power Monitor, Compensation | Power Sensor | ||
| Selective Soldering | Option | ||
| Beam Profile & Size Func. | Option | ||