PROCESS AUTOMATION SYSTEM

Various types of equipment are available for process integration of IC packaging.

제품이미지
BLS-5000
System Features
  • ▶ Strip loading system having a substrate strip assembled with carrier boat and top cover

System Performance
  • ▶ Strip size allowed: 62~95mm Strip & Boat

    ▶ UPH: 500 strips 

    ▶ Footprint: 1100mm(L) x 1000mm(W) x 1750(H)

    ▶ Foot weight: 1000kg  

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BUS-7000
System Features
  • ▶ Off-loader system having substrate strips loaded into a magazine  

    ▶ Substrate strip size allowed: 30mm-80mm(W) × 185mm-260mm(L)

    ▶ Footprint: 1350mm(L) x 1180mm(W) x 1820(H)

    ▶ Foot weight: 900kg  

System Performance
  • ▶ Warpage handling: Less than 20mm

  • ▶ UPH: 500 strips

    ▶ Changeover: No conversion kits required

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SUS-3000
System Features
  • ▶ Off-loader system having substrate strips loaded into a strip magazine    

    ▶ Footprint: 895mm(L) x 1182mm(W) x 1350(H)

    ▶ Foot weight: 750kg   

System Performance
  • ▶ Conversion Range : 40 ~ 150mm

    ▶ UPH: 500 strips 

    ▶ 2DID reader available 

제품이미지
SLS-3000
System Features
  • ▶ Unloading system that takes substrate strips from a magazine       

    ▶ Footprint: 1005mm(L) x 1182mm(W) x 1350(H)

    ▶ Foot weight: 800kg

System Performance
  • ▶ Conversion Range : 40 ~ 150mm

    ▶ Productivity - UPH: 500 strips

    ▶ 2D barcode reader available 

제품이미지
ASU-6000
System Features
  • ▶ Strip off-loading system to peel off carrier boat and top cover from a substrate strip  

    ▶ Carrier format: Substrate strip and Carrier boat/jig 

System Performance
  • ▶ Product size allowed: 62~95mm Strip & Boat

  • ▶ Footprint: 1040mm(L) x 1440mm(W) x 1730mm(H)

    ▶ Foot weight: 1300kg 

    ▶ Yield: 99.99% 

    ▶ UPH: 300-500 strips

제품이미지
ASL-6000
System Features
  • ▶ Automatic strip loader to have a substrate strip assembled with carrier boat and top cover 

    ▶ Carrier size allowed: 62~95mm Strip & Boat 

System Performance
  • ▶ Strip Marking Method : CO2 Laser Marking System

    ▶ Footprint: 1900mm(L) x 900mm(W) x 1820(H)

    ▶ Foot weight: 1500kg

    ▶ Yield: 99.99%

    ▶ UPH: 300-500 strips

제품이미지
ADS-3000
System Features
  • ▶ Lane diverter for strips or carrier boat 

    ▶ Carrier format: Substrate strip of 74, 77.5 or 95mm in width or subsidiary carrier jig

    ▶ Foot print: 550mm(L) x 950mm(W) x 1820mm(H)

    ▶ Weight: 700kg   

System Performance
  • ▶ SPH: 400strip/hr  

     Accuray: ±0.1mm 

제품이미지
WUS-5000
System Features
  • ▶ Wafer unloading system having wafers loaded into a magazine 

    ▶ Handling system: 4 inch wafer and wafer carrier jig  

    ▶ Foot print: 1400mm(L) x 1200mm(W) x 1700mm(H)  

System Performance
  • ▶ Cycle time: 60sec/wafer 

    ▶ Yield performance: 100% 

    ▶ Placement accuracy: ±0.02mm

     

제품이미지
WLS-5000V
System Features
  • ▶ Wafer loading system with 2D visual inspection camera

    ▶ Handling system: 4 inch wafer and wafer carrier jig  

    ▶ Foot print: 1400mm(L) x 1200mm(W) x 1700mm(H) 

System Performance
  • ▶ Cycle time: 60sec/wafer 

    ▶ Inspection system: 2D visual inspection system  

    ▶ Yield performance: 99.98%  

    ▶ Placement accuracy: ±0.02mm 

     

     

제품이미지
ASA-7200V
System Features
  • ▶ Stiffener or lid attach system 

    ▶ Applicable package: FCBGA

    ▶ Package size allowed: FCBGA 13×13 – 80×80 with stiffener

    ▶ Footprint: 3100mm(L) x 1930mm(W) x 2300(H)

    ▶ Foot weight: 4200kg 

System Performance
  • ▶ Attachment Method : Max. 220 ℃ Epoxy heat adhesive

    ▶ Inspection Unit : Look down camera for unit 

    ▶ Look up camera for Stiffener Alignment and orientation

    ▶ Post Inspection Vision

    ▶ Cycle time: 7sec/strip 

    ▶ Quick Changeover: Vacuum Block, Flux Stencil

    ▶ UPH: 1000-1300

제품이미지
TDS-2000
System Features
  • ▶ Detaping system to peel a protection film off a molded strip 

    ▶ Applicable package: MLF, QFN or MAP type of leadframe package  

    ▶ Package size allowed: 60-95mm(W) × 200-260mm(L) 

    ▶ Footprint: 1925mm(L) x 1100mm(W) x 1800(H) 

    ▶ Foot weight: 1800kg  

System Performance
  • ▶ Gripp and Demount : Simple conversion and operation

  • ▶ UPH: 120 strips

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TDS-1000
System Features
  • ▶ Detaping system to peel a protection film off EMI shielded parts 

    ▶ Applicable package: LGA 

    ▶ Package size allowed: 3x3mm – 20x20mm 

    ▶ Footprint: 1825mm(L) x 1615mm(W) x 1610(H) 

    ▶ Foot weight: 2000kg  

System Performance
  • ▶ Vision

       ▷ Surface inspection

       ▷ Empty pocket inspection

    ▶ Reject unit sorting function

    ▶ Cycle time: 1min/tray

제품이미지
TAS-1000
System Features
  • ▶ Taping system to attach a protection film onto a leadframe strip 

    ▶ Applicable package: QFN, MLF or MAP type of leadframe package  

    ▶ Product size allowed: Strip 50~95mm(L) X 230~250mm(W)

    ▶ Footprint: 1200mm(L) x 1240mm(W) x 1550(H) 

    ▶ Foot weight: 900kg 

System Performance
  • ▶ UPH: 50~350 strips per strip format