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CONTACT US
ENG
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COMPANY
Message from CEO
Management Philosophy
QESH Management Policy
Code of Ethics
History
Partner Company
Locations
PRODUCT
BALL PLACEMENT SYSTEM
LASER APPLICATION SYSTEM
PROCESS AUTOMATION SYSTEM
PACKAGE SORTER P&P SYSTEM
CAMERA MODULE ASSEMBLY SYSTEM
PACKAGE EMI SHIELDING SYSTEM
TOOL & OTHERS
R  &   D
Introduction of R&D Center
Major Research Activities
Technology / Company Certificate
CONTACT
Online Inquiry
Global Network
PR
Media Report
Notice
E-Brochure / Video
RECRUIT
Concept of Talent
Education System
Welfare Benefits
Recruit FAQ
Job Application
COMPANY
Message from CEO
Management Philosophy
QESH Management Policy
Code of Ethics
History
Partner Company
Locations
PRODUCT
BALL PLACEMENT SYSTEM
LASER APPLICATION SYSTEM
PROCESS AUTOMATION SYSTEM
PACKAGE SORTER P&P SYSTEM
CAMERA MODULE ASSEMBLY SYSTEM
PACKAGE EMI SHIELDING SYSTEM
TOOL & OTHERS
R&D
Introduction of R&D Center
Major Research Activities
Technology / Company Certificate
CONTACT
Online Inquiry
Global Network
PR
Media Report
Notice
E-Brochure / Video
RECRUIT
Concept of Talent
Education System
Welfare Benefits
Recruit FAQ
Job Application
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SSP R&D Center's research and development performances.
Patent Certificate
Design Registration Certificate
Utility Model Registration Certificate
Main Certificates
Patent No
Name of Invention
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0145674
SOLDER BALL SAFE ARRIVAL EQUIPMENT OF IC PACKAGE
0196286
An opening and shutting valve structure using supplysolder ball in ball dispensor
0196527
The solder ball supplying box on ball dispenser
0319230
Attaching apparatus for housing of camera modulecomprising dipping part and attaching method using thesame
0319230
Solder ball mounting equipment for Ball Grid Arraypackage
0240580
The apparatus for the changing a situation ofsemiconduction's strip for the marking operations
1