Technology / Company Certificate

SSP R&D Center's research and development performances.

Patent No Name of Invention View
0145674 SOLDER BALL SAFE ARRIVAL EQUIPMENT OF IC PACKAGE
0196286 An opening and shutting valve structure using supplysolder ball in ball dispensor
0196527 The solder ball supplying box on ball dispenser
0319230 Attaching apparatus for housing of camera modulecomprising dipping part and attaching method using thesame
0319230 Solder ball mounting equipment for Ball Grid Arraypackage
0240580 The apparatus for the changing a situation ofsemiconduction's strip for the marking operations
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