Technology / Company Certificate
SSP R&D Center's research and development performances.
| Patent No | Name of Invention | View |
|---|---|---|
| 10-1162625 | Ball mount apparatus comprising inkjet type flux tool |  |
| 10-1170985 | Transferring device comprising aligning means and transferring method using the same | |
| 10-1410171 | Wafer bumping apparatus and bumping method using the same | |
| 10-1420185 | Electronic part test handler and method of inspecting residual part using the same | |
| 10-1475886 | Ball supplier and solder ball bumping method using the same | |
| 10-1502150 | Solder ball supplier | |
| 10-1502151 | Solder ball supplier using wire brush | |
| 10-1550688 | Solder ball supplier using air curtain | |
| 10-1604582 | A device for coating semiconductor packages | |
| 10-1621667 | A carring and arranging apparatus using multi picker and preciser | |
