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CONTACT US
ENG
KOR
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COMPANY
Message from CEO
Management Philosophy
QESH Management Policy
Code of Ethics
History
Partner Company
Locations
PRODUCT
BALL PLACEMENT SYSTEM
LASER APPLICATION SYSTEM
PROCESS AUTOMATION SYSTEM
PACKAGE SORTER P&P SYSTEM
CAMERA MODULE ASSEMBLY SYSTEM
PACKAGE EMI SHIELDING SYSTEM
TOOL & OTHERS
R & D
Introduction of R&D Center
Major Research Activities
Technology / Company Certificate
CONTACT
Online Inquiry
Global Network
PR
Media Report
Notice
E-Brochure / Video
RECRUIT
Concept of Talent
Education System
Welfare Benefits
Recruit FAQ
Job Application
COMPANY
Message from CEO
Management Philosophy
QESH Management Policy
Code of Ethics
History
Partner Company
Locations
PRODUCT
BALL PLACEMENT SYSTEM
LASER APPLICATION SYSTEM
PROCESS AUTOMATION SYSTEM
PACKAGE SORTER P&P SYSTEM
CAMERA MODULE ASSEMBLY SYSTEM
PACKAGE EMI SHIELDING SYSTEM
TOOL & OTHERS
R&D
Introduction of R&D Center
Major Research Activities
Technology / Company Certificate
CONTACT
Online Inquiry
Global Network
PR
Media Report
Notice
E-Brochure / Video
RECRUIT
Concept of Talent
Education System
Welfare Benefits
Recruit FAQ
Job Application
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SSP R&D Center's research and development performances.
Patent Certificate
Design Registration Certificate
Utility Model Registration Certificate
Main Certificates
Patent No
Name of Invention
View
0196365
Mount apparatus for solder ball of ball grid array
0196366
Solder ball adhesion method, and its apparatus of ic package
0196367
Solder ball adhesion method, and its apparatus of ic package
0296424
Ball feeder of the ball dispensor
0362364
In Line system for operating ball mounting and markingin manufacturing process of semiconductor
0476076
Attaching apparatus for housing of camera modulecomprising dipping part and attaching method using thesame
0498071
Attaching apparatus for housing of camera module andattaching method using the same
0503760
Automatic testing apparatus for image sensor of cameramodule and automatic testing method using the same
10-0625855
Lens barrel combining apparatus for camera module andcombining method using the same
10-0661844
Method of determining reference value in solder ballmounting apparatus and computer readable medium thereof
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